Dry Film Exposure Method Alternative to Ironing Method for Printed Circuit Production
The peeled face is placed on the cleaned copper plate. side is glued. During this process, care should be taken to ensure that no air bubbles remain between the film and the copper plate.
The process of gluing the film to the plaque is carried out using a laminating device that is not too hot or an iron at constant temperature.
High resolution printout is taken on transparent film or colorless acetate for PCB. Since the film is negative, the output colors should be reversed.
Plaque, film and After squeezing the acetate between two glasses to prevent it from slipping, UV fluorescent or LED; If these cannot be found, exposure is performed with an energy-saving bulb. (It is recommended to expose it for 2-3 minutes with an ultraviolet source and 20-25 minutes with a white light source until the paths become clear.)
After the exposure process is completed, the protective layer on the other side of the film is removed and thrown into the developer solution. (1 gram developer:100 grams water ratio) (Developer: Pure Sodium Carbonate)
It is thrown into the acid solution of your choice. As in the ironing method, the areas to be melted are waited until they melt.
Film process By determining the ideal times with 4mil road / 4mil gap (0.01mm / 0.01mm) precision can be achieved.
UV light is harmful to health. If a UV source is used during exposure, necessary precautions should be taken.
The film should be opened and processed in a dark environment (Only weak red light can be used as a source). The properties of the film may decrease if exposed to light. Storage should be done in a dark environment.
After receipt, it can be cut to the desired size and used.
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